India’s ₹27,000 crore semiconductor manufacturing facility at Jagiroad in Assam is likely to commence production during the current fiscal year, Union Electronics and Information Technology Minister Ashwini Vaishnaw has said. The greenfield project is expected to play a significant role in strengthening India’s semiconductor ecosystem and advancing the country’s efforts toward self-reliance in chip manufacturing.
The high-volume manufacturing facility will undertake multiple stages of semiconductor packaging and testing. A key component of the process is IC package design, which determines how an integrated circuit is interconnected, encapsulated and integrated with external systems. This stage is critical for ensuring electrical performance, thermal management, mechanical protection and long-term reliability of semiconductor devices.
The manufacturing process will also include wafer and die preparation, where silicon wafers embedded with integrated circuits are transformed into individual functional chips. This involves wafer thinning, singulation and pick-and-place operations.
Another crucial stage is interconnection, which establishes electrical links between the integrated circuit die and external systems. Depending on performance requirements and design constraints, techniques such as wire bonding, flip-chip and through-silicon vias (TSVs) may be used to ensure signal integrity, reliability and functionality.
The finishing process involves molding or encapsulating the die for protection, followed by deflashing to remove excess molding material. Laser marking is then carried out to provide permanent identification and traceability, while singulation separates individual units in preparation for testing and shipment.
Testing forms an essential part of the manufacturing cycle, ensuring that packaged integrated circuits meet required performance standards and operate reliably throughout their lifecycle. The facility will also conduct failure analysis and reliability assessments to identify the root causes of potential failures and evaluate chip performance under conditions such as thermal stress, vibration, mechanical shock and humidity.
The commencement of production at the Jagiroad facility is expected to mark a significant step in India’s semiconductor manufacturing journey and strengthen Assam’s position in the country’s emerging electronics and semiconductor sector.